Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0646-G DFRobot	GRAVITY 8-DIGIT LED SEGMENT GR	9
SEN0165 DFRobot	ANALOG ORP METER V1.0	0
TEL0124 DFRobot	SIM7600CE-T 4G(LTE)/GNSS SHIELD	0
SEN0038 DFRobot	WHEEL ENCODERS FOR ARDUINO TT MO	0
DFR0018 DFRobot	GRAVITY: 9 PCS SENSOR SET FOR AR	0
ROB0150 DFRobot	MICRO: CIRCULAR RGB LED EXPANSIO	5
DFR0029-B DFRobot	GRAVITY: DIGITAL PUSH BUTTON (BL	0
DFR0548 DFRobot	MICRO:BIT DRIVER EXPANSION BOARD	0
SEN0128 DFRobot	ANALOG ALCOHOL SENSOR(MQ3)	0
DFR0604 DFRobot	IO EXPANSION HAT FOR PI ZERO/ZER	46
DFR0552 DFRobot	GRAVITY: I2C 12-BIT DAC MODULE	8
DFR0462 DFRobot	GRAVITY: FLEXIBLE 8X32 RGB LED M	0
TEL0125 DFRobot	FIREBEETLE COVERS-LORA RADIO 868	0
SEN0204 DFRobot	GRAVITY: NON-CONTACT LIQUID LEVE	0
DFR0572 DFRobot	SIM7000E ARDUINO NB-IOT/LTE/GPRS	0
DFR0311 DFRobot	ARDUINO EXPANSION SHIELD FOR RAS	0
DFR0272 DFRobot	ETHERNET SHIELD FOR ARDUINO - W5	0
DFR0285 DFRobot	BEETLE SHIELD	0
DFR0411 DFRobot	GRAVITY: 130 DC MOTOR MODULE	0
MBT0016 DFRobot	MATH TOUCH KEYBOARD FOR MICRO:BI	49

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems