Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0231-H DFRobot	GRAVITY: UART I2C NFC MODU	20
DFR0219 DFRobot	GRAVITY: RS485 IO EXPANSION SHIE	9
DFR0449 DFRobot	EXPANSION SHIELD X400 FOR RASPBE	4
DFR0626 DFRobot	GRAVITY I2C 16 DIGITAL IO EXPAND	63
SEN0250 DFRobot	GRAVITY: I2C BMI160 6-AXIS INERT	33
DRI0044-A DFRobot	2X1.2A MOTOR DRIVER GRAVITY BRD	5
SEN0313 DFRobot	A01NYUB WATERPROOF ULTRASONIC SE	7
DFR0210 DFRobot	BEES SHIELD	0
DFR0299 DFRobot	DFPLAYER - A MINI MP3 PLAYER	2752
DFR0030 DFRobot	GRAVITY: DIGITAL CAPACITIVE TOUC	4
DFR0494 DFRobot	RASPBERRY PI UPS HAT	73
SEN0131 DFRobot	ANALOG LPG GAS SENSOR(MQ6)	1
SEN0244 DFRobot	GRAVITY ANALOG TDS SENSOR/METER	52
DFR0151 DFRobot	REAL TIME CLOCK MODULE (DS1307)	33
SEN0364 DFRobot	GRAVITY: AS7341 11-CHANNEL VISIB	41
SEN0337 DFRobot	TOF SENSE LASER RANGE SENSOR 5M	24
FIT0477 DFRobot	7-INCH 1024X600 IPS DISPLAY FOR	174
SEN0132 DFRobot	GRAVITY:ANALOG CARBON MONOXIDE S	11
DFR0076 DFRobot	GRAVITY:ANALOG FLAME SENSOR	3
DFR0094 DFRobot	GRAVITY:DIGITAL IR RECEIVER MODU	5

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems