Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SEN0237-A DFRobot	GRAVITY: ANALOG DISSOLVED OXYGEN	0
SEN0130 DFRobot	GRAVITY: ANALOG GAS SENSOR(MQ5)	0
SEN0287 DFRobot	GRAVITY: ANALOG AC CURRENT SENSO	30
DFR0029-Y DFRobot	GRAVITY:DIGITAL PUSH BUTTON (YEL	0
SEN0156 DFRobot	ROTARY SWITCH MODULE V1	0
FIT0449 DFRobot	GRAVITY: DIGITAL SPEAKER MODULE	0
DFR0031-Y DFRobot	GRAVITY:DIGITAL PIRANHA LED LIGH	0
DFR0029-W DFRobot	GRAVITY:DIGITAL PUSH BUTTON (WHI	0
TEL0044 DFRobot	DFRDUINO GPS SHIELD FOR ARDUINO	0
SEN0184 DFRobot	5MP NIGHT VISION CAMERA FOR RASP	0
DFR0209 DFRobot	6 DOF IMU SHIELD	0
DFR0231 DFRobot	NFC MODULE FOR ARDUINO	1
DFR0465 DFRobot	GRAVITY: EXPANSION SHIELD FOR IN	0
SEN0162 DFRobot	GRAVITY:ANALOG UV SENSOR V2	0
DFR0566 DFRobot	IO EXPANSION HAT FOR RASPBERRY P	69
DFR0310 DFRobot	UPPER DECK FOR MINIQ	0
DFR0463 DFRobot	GRAVITY: FLEXIBLE 16X16 RGB LED	0
SEN0172 DFRobot	ANALOG LIGHT SENSOR LX1972	0
SEN0221 DFRobot	GRAVITY: 360 DEGREE HALL ANGLE S	0
SEN0043 DFRobot	ANALOG AMBIENT LIGHT SENSOR TEMT	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems