Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0386 DFRobot	DS1307 RTC MODULE WITH BATTERY F	0
DFR0058 DFRobot	GRAVITY:ANALOG ROTATION SENSOR V	0
SEN0042 DFRobot	GRAVITY:DIGITAL INFRARED DISTANC	0
SEN0161 DFRobot	ANALOG PH METER KIT	0
DFR0066 DFRobot	GRAVITY:SHT1X HUMIDITY AND TEMPE	0
DRI0035 DFRobot	TMC260 STEPPER MOTOR DRIVER SHIE	18
DFR0012 DFRobot	NANO I/O SHIELD FOR ARDUINO NANO	0
SEN0161-V2 DFRobot	GRAVITY: ANALOG PH SENSOR/METER	0
TEL0113 DFRobot	GRAVITY: UART A6 GSM GPRS	0
DFR0071 DFRobot	SD MODULE (ARDUINO COMPATIBLE)	0
DFR0338 DFRobot	IO EXPANSION SHIELD FOR INTEL E	0
DFR0565 DFRobot	GRAVITY: DIGITAL I2C SIGNAL ISOL	0
DFR0645-R DFRobot	GRAVITY 4-DIGIT LED SEGMENT RED	0
SEN0177 DFRobot	PM2.5 SENSOR MODULE - LASER SENS	0
DFR0300 DFRobot	ANALOG ELECTRICAL CONDUCTIVITY M	0
DFR0060 DFRobot	SCREW SHIELD FOR ARDUINO	0
SEN0169 DFRobot	ANALOG PH METER PRO	0
DFR0720 DFRobot	BLUETOOTH 4.2 AUDIO RECEIVER BOA	35
SEN0285 DFRobot	GESTURE & TOUCH SENSOR	28
SEN0305-S DFRobot	GRAVITY: HUSKYLENS WITH SILICONE	16

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems