Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0511 DFRobot	FIREBEETLE COVERS-EPAPER BLACK&A	0
SEN0206 DFRobot	IR THERMOMETER SENSOR-MLX90614	0
DFR0370 DFRobot	CAN BUS SHIELD FOR ARDUINO	0
DFR0031 DFRobot	GRAVITY:DIGITAL PIRANHA LED MODU	0
SEN0164 DFRobot	ADJUSTABLE INFRARED SENSOR SWITC	0
DFR0287 DFRobot	LCD12864 SHIELD FOR ARDUINO	0
DRI0001 DFRobot	1A MOTOR SHIELD FOR ARDUINO	0
SEN0134 DFRobot	ANALOG CO/COMBUSTIBLE GAS SENSOR	0
DFR0498 DFRobot	FIREBEETLE COVERS-CAMERAAUD	0
DFR0308 DFRobot	DTMF SHIELD	0
FIT0515 DFRobot	10.1&QUOT 1200 X 1920 IPS DISPLA	7
DFR0763 DFRobot	SIM7000A ARDUINO NB-IOT EXPANSIO	19
DFR0385 DFRobot	GPIO TRIPLE EXPANSION HAT FOR RA	0
SEN0288 DFRobot	GRAVITY: ANALOG AC CURRENT SENSO	26
DFR0374 DFRobot	LCD KEYPAD SHIELD V2.0 FOR ARDUI	0
DFR0125 DFRobot	DFRDUINO ETHERNET SHIELD V2.1 (S	23
DFR0332 DFRobot	FAN MODULE	0
DFR0486 DFRobot	GRAVITY I2C OLED-2864 DISPLAY	0
DFR0605 DFRobot	GRAVITY: DIGITAL RGB LED MODULE	14
DFR0399 DFRobot	GRAVITY: DC MICRO METAL GEAR MOT	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems