Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DFR0273 DFRobot	SPEECH SYNTHESIS SHIELD FOR ARDU	0
MBT0008 DFRobot	MICRO:IO EXTENDER- A MICRO:BIT I	29
DFR0645-G DFRobot	GRAVITY 4-DIGIT LED SEGMENT GR	7
DFR0507 DFRobot	FIREBEETLE COVERS-OLED12864 DISP	12
DFR0531 DFRobot	FIREBEETLE COVERS-EPAPER BLACK&A	0
DFR0129 DFRobot	CAPACITIVE TOUCH KIT FOR ARDUINO	0
DFR0438 DFRobot	GRAVITY: BRIGHT LED MODULE	0
DFR0051 DFRobot	GRAVITY: ANALOG VOLTAGE DIVIDER	0
DFR0334 DFRobot	GRAVITY: GPIO SHIELD FOR ARDUINO	0
TEL0083-A DFRobot	GPS RECEIVER FOR ARDUINO (MODEL	0
DFR0314 DFRobot	BARCODE READER/SCANNER MODULE -	0
SEN0220 DFRobot	GRAVITY: UART INFRARED CO2 SENSO	0
DFR0358 DFRobot	EXPANSION SHIELD X300 FOR RASPBE	0
DFR0312 DFRobot	RASPBERRY PI GPIO EXTENSION BOAR	0
DFR0384 DFRobot	PROTOTYPING HAT FOR RASPBERRY PI	0
TOY0017 DFRobot	JOYSTICK MODULE(.NET GADGETEER C	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems