Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
COM-16566 SparkFun	SPARKFUN QWIIC QUAD RELAY	15
DEV-14148 SparkFun	DAQCPLATE PI-PLATE	18
DEV-15837 SparkFun	SPARKFUN WEATHER:BIT - MICRO:BIT	19
BOB-15734 SparkFun	QWIIC 5P49V60 CLOCK GENERATR BRD	0
BOB-13988 SparkFun	MICRO:BIT BREAKOUT	0
DEV-14044 SparkFun	SPECTACLE BUTTON BOARD	0
SEN-15805 SparkFun	TEMPERATURE SENSOR TMP117 QWIIC	266
DEV-16829 SparkFun	MICROMOD DATA LOGGING CARRIER	115
WIG-18013 SparkFun	ELEKTOR 6-CHANNEL TEMPERATURE MO	0
SEN-15436 SparkFun	AMBIENT LIGHT SENSOR - VEML6030	118
DEV-12761 SparkFun	SPARKFUN MICROSD SHIELD	18
SEN-14349 SparkFun	HUMAN PRESENCE SENSOR BREAKOUT A	9
SEN-15273 SparkFun	GATOR:UV - MICRO:BIT ACCESSORY B	13
GPS-16475 SparkFun	GPS-RTK DEAD RECKONING PHAT FOR	8
SEN-14686 SparkFun	VR IMU BREAKOUT BNO080 QWIIC	37
DEV-12774 SparkFun	SPARKFUN BEAGLEBONE BLACK PROTO	22
KIT-16987 SparkFun	SPARKFUN QWIIC SHIM KIT FOR RASP	45
ROB-12567 SparkFun	SPARKFUN REDBOT BUZZER	0
DEV-09760 SparkFun	SPARKFUN JOYSTICK SHIELD KIT	0
SEN-15272 SparkFun	GATOR:SOIL - MICRO:BIT ACCESSORY	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems