Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DEV-14149 SparkFun	MOTORPLATE PI-PLATE	4
SEN-16304 SparkFun	DIGITAL TEMP SENSOR TMP102 QWIIC	117
SEN-17372 SparkFun	SPARKFUN PIR BREAKOUT - 170UA (E	50
DEV-14319 SparkFun	JUSTBOOM DAC HAT	0
SEN-14607 SparkFun	GRID-EYE INFRARED ARRAY BREAKOUT	76
DEV-14215 SparkFun	SPARKFUN GAMER BIT	663
DEV-14443 SparkFun	PROTO BOARD FOR ONION OMEGA	0
DEV-14352 SparkFun	QWIIC SHIELD FOR ARDUINO	64
WRL-16984 SparkFun	SPARKFUN MICROMOD NRF52840 PROCE	94
DEV-15801 SparkFun	POWER DELIVERY USB-C QWIIC	130
LCD-16398 SparkFun	SPARKFUN 20X4 SERLCD - RGB BACKL	49
DEV-14317 SparkFun	JUSTBOOM DIGI HAT	0
SEN-15177 SparkFun	QWIIC VCNL4040 PROXIMITY SENSOR	34
ROB-16773 SparkFun	ZIO 16 SERVO CONTROLLER (QWIIC)	22
SEN-15271 SparkFun	GATOR:PARTICLE - MICRO:BIT ACCES	39
GPS-17285 SparkFun	SPARKFUN GPS BREAKOUT - NEO-M9N,	24
LCD-16396 SparkFun	SPARKFUN 16X2 SERLCD - RGB BACKL	0
GPS-15210 SparkFun	SPARKFUN GPS BREAKOUT - CHIP ANT	84
GPS-16344 SparkFun	GPS-RTK DEAD RECKONING BREAKOUT	40
GPS-16481 SparkFun	GPS-RTK-SMA ZED-F9P BREAKOUT	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems