Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
GPS-14414 SparkFun	GPS BREAKOUT - XA1110 (QWIIC)	48
DEV-13992 SparkFun	SPECTACLE INERTIA BOARD	0
SPX-17729 SparkFun	QWIIC AIR QUALITY SENSOR - SGP40	0
DEV-14484 SparkFun	GATOR:BIT	0
BOB-13717 SparkFun	SPARKFUN PI WEDGE (PREASSEMBLED)	24
SPX-14570 SparkFun	ENVIROMENTAL QWIIC SENSOR BME680	0
SPX-15586 SparkFun	QWIIC SWITCH	0
CEL-14997 SparkFun	LTE CAT M1/NB-IOT SHIELD - SARA-	0
SPX-14848 SparkFun	1.54 INCH EPAPER BARE DISPLAY	0
SPX-15074 SparkFun	HUMIDITY SENSOR BREAKOUT SHTC3	0
DEV-16653 SparkFun	TOP PHAT FOR RASPBERRY PI	96
SPX-14804 SparkFun	ATTO84 WITH ARDUINO BOOTLOADER	0
SPX-14767 SparkFun	QWIIC PRESSURE SENSOR - LPS25HB	0
SPX-16770 SparkFun	QWIIC PT100 - ADS122C04	0
DEV-15849 SparkFun	ALCHITRY IO ELEMENT BOARD	0
SPX-15591 SparkFun	QWIIC ARCADE - RED	0
DEV-15850 SparkFun	ALCHITRY BR PROTO ELEMENT BOARD	0
SPX-15508 SparkFun	QWIIC THERMOCOUPLE AMPLIFIER - M	0
COM-16810 SparkFun	SPARKFUN QWIIC DUAL SOLID STATE	30
SPX-14788 SparkFun	QWIIC RF - LORA-ENABLED 915MHZ	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems