Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SPX-16677 SparkFun	SPARKX REFRIGERATION GAS SENSOR	0
DEV-15080 SparkFun	QWIIC EXPANSION BOARD FOR ONION	0
DEV-16400 SparkFun	MICROMOD MACHINE LEARN CARRIER	47
SEN-14351 SparkFun	QWIIC SPECTRAL SENSOR BRD AS7263	0
DEV-13629 SparkFun	PHOTON IMU SHIELD 13629	0
LCD-15890 SparkFun	ZIO QWIIC OLED DISPLAY	37
DEV-14634 SparkFun	NFC-RFID EXPANSION BOARD FOR ONI	0
DEV-17119 SparkFun	SPARKFUN QWIIC SHIELD FOR TEENSY	69
SPX-17522 SparkFun	QWIIC IR THERMOMETER - MLX90614	0
WRL-12847 SparkFun	XBEE SHIELD WIRELESS	82
SEN-17373 SparkFun	SPARKFUN PIR BREAKOUT - 1UA (EKM	50
SEN-14348 SparkFun	QWIIC ENVIRONMENTAL COMBO BRKOUT	49
DEV-14129 SparkFun	ARDUMOTO - MOTOR DRIVER SHIELD	9
SEN-17241 SparkFun	SPARKFUN TRIPLE AXIS DIGITAL ACC	54
DEV-14285 SparkFun	WIRELESS MOTOR DRIVER SHIELD	0
DEV-15421 SparkFun	TEENSY AUDIO ADAPTOR BOARD	17
SEN-14844 SparkFun	ARRAY BREAKOUT 55 FOV MLX90640	0
DEV-14440 SparkFun	POWER DOCK 2 FOR ONION OMEGA	0
COM-15486 SparkFun	GATOR:RTC - MICRO:BIT ACCESSORY	5
SEN-17375 SparkFun	SPARKFUN QWIIC PIR - 1UA (EKMB11	50

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems