Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
DEV-15945 SparkFun	SPARKFUN QWIIC PHAT V2.0	62
DEV-15164 SparkFun	QWIIC OPENLOG	48
COM-15453 SparkFun	EASYVR SHIELD 3.0 - VOICE RECOGN	16
DEV-13819 SparkFun	ARDUINO PROTOSHIELD BARE PCB	114
DEV-16129 SparkFun	CONTROLLER:BIT - QWIIC	0
SEN-14666 SparkFun	QWIIC FLEX GLOVE CONTROLLER	2
BOB-14558 SparkFun	REAL TIME CLOCK MOD RV-1805 QWII	14
DEV-14038 SparkFun	PIMORONI BLINKT	0
DEV-17526 SparkFun	ALCHITRY FT ELEMENT BOARD	14
SEN-14722 SparkFun	QWIIC 4M DISTANCE SENSOR VL53L1X	105
DEV-15334 SparkFun	QWIIC 12BIT ADC 4CHANNEL ADS1015	75
SEN-16531 SparkFun	AIR QUALITY SENSOR - SGP30 (QWII	0
DEV-14495 SparkFun	QWIIC ADAPTER	389
GPS-16329 SparkFun	NEO-M8U GPS DEAD RECKONING BRD	41
DEV-13688 SparkFun	MYOWARE LED SHIELD	0
SEN-15289 SparkFun	GATOR:MICROPHONE - MICRO:BIT ACC	55
DEV-11723 SparkFun	MUX SHIELD II	35
SEN-16467 SparkFun	HUMIDITY SENSOR BREAKOUT - SHTC3	87
GPS-15733 SparkFun	GPS BREAKOUT NEO-M9N QWIIC CHIP	34
LCD-14532 SparkFun	MICRO OLED BREAKOUT QWIIC	48

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems