Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
LCD-17153 SparkFun	SPARKFUN QWIIC OLED DISPLAY (0.9	152
DEV-16790 SparkFun	QWIIC SHIELD FOR THING PLUS	18
DEV-16138 SparkFun	SPARKFUN QWIIC SHIELD FOR THING	78
SPX-17001 SparkFun	QWIIC BMP388 PRESSURE SENSOR	0
LCD-16777 SparkFun	OPENMV LCD SHIELD	26
DEV-16789 SparkFun	QWIIC SHIELD FOR ARDUINO NANO	25
SEN-16794 SparkFun	SPARKFUN MICROMOD WEATHER CARRIE	47
DEV-15110 SparkFun	ESP32 THING PLUS DMX LED SHIELD	13
DEV-17047 SparkFun	SPARKFUN QWIIC GPIO	197
DEV-14040 SparkFun	PIMORONI DISPLAY-O-TRON HAT	0
SPX-16906 SparkFun	QWIIC MULTIPORT	0
DEV-14598 SparkFun	SPARKFUN AST-CAN485 I/O SHIELD (	14
DEV-14037 SparkFun	PIMORONI UNICORN HAT	0
DEV-16985 SparkFun	MICROMOD INPUT/DISPLAY CARRIER	47
LCD-15079 SparkFun	QWIIC TRANSPARENT OLED HUD BOARD	1
DEV-16130 SparkFun	SPARKFUN QWIIC SHIELD FOR ARDUIN	6
GPS-14030 SparkFun	MINI GPS SHIELD	3
GPS-15005 SparkFun	GPS RTK BOARD NEO-M8P-2 QWIIC	3
ROB-15451 SparkFun	QWIIC MOTOR DRIVER	25
DEV-15083 SparkFun	SPARKFUN QWIIC TWIST - RGB ROTAR	27

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems