Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SPX-17046 SparkFun	QWIIC CHIRP 101 ULTRASONIC RANGE	1
SEN-11769 SparkFun	SPARKFUN REDBOT SENSOR - LINE FO	321
WRL-16776 SparkFun	OPENMV WIFI SHIELD	23
SEN-15089 SparkFun	SPARKFUN UV LIGHT SENSOR BREAKOU	3
SEN-14891 SparkFun	SPARKFUN GATOR STARTER PROTOSNAP	0
BOB-16281 SparkFun	RV-8803 RTC MODULE QWIIC	99
DEV-10406 SparkFun	SPARKFUN RFID EVALUATION SHIELD	0
SEN-16294 SparkFun	QWIIC THERMOCOUPLE AMP PCC CONN	42
WRL-13287 SparkFun	WIFI SHIELD - ESP8266	17
BOB-16784 SparkFun	QWIIC MUX BREAKOUT - 8 CHANNEL (	73
DEV-14531 SparkFun	PSOC PIONEER IOT ADD-ON SHIELD	0
DEV-14809 SparkFun	SPARKFUN I2S AUDIO BREAKOUT - MA	27
COM-15093 SparkFun	QWIIC SINGLE RELAY	69
DEV-16892 SparkFun	SPARKFUN QWIIC MP3 TRIGGER	29
DEV-13996 SparkFun	TEENSY PROP SHIELD LC	4
ROB-16328 SparkFun	AUTO PHAT FOR RASPBERRY PI	81
DEV-14477 SparkFun	QWIIC SHIELD FOR PHOTON	0
DEV-14436 SparkFun	BREADBOARD DOCK FOR ONION OMEGA	0
DEV-13158 SparkFun	SPARKFUN LIPOWER SHIELD 13158	0
KIT-18004 SparkFun	ELEKTOR DIY LIPO SUPERCHARGER KI	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems