Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SEN-16295 SparkFun	QWIIC THERMOCOUPLE AMP SCREW TRM	19
DEV-15845 SparkFun	TEENSY AUDIO ADAPTER BOARD REV D	82
DEV-16525 SparkFun	ALCHITRY IO ELEMENT BOARD	0
DEV-14459 SparkFun	QWIIC HAT FOR RASPBERRY PI	36
DEV-15096 SparkFun	SPARKFUN SERIAL BASIC BREAKOUT -	97
BOB-13989 SparkFun	MICRO:BIT BREAKOUT (WITH HEADERS	287
DEV-14437 SparkFun	MINI DOCK FOR ONION OMEGA	0
KIT-16833 SparkFun	SPARKFUN QWIIC QUAD SOLID STATE	25
LCD-17520 SparkFun	LCD TOUCHSCREEN HAT FOR RASPBERR	14
DEV-15046 SparkFun	SMARTLED SHIELD V4 FOR TEENSY	11
GPS-15136 SparkFun	GPS-RTK2 BOARD - ZED-F9P (QWIIC)	19
DEV-15713 SparkFun	MOTO:BIT QWIIC CARRIER BOARD	31
DEV-09947 SparkFun	USB HOST SHIELD	43
LCD-14048 SparkFun	SPARKFUN TEENSYVIEW	3
DEV-15794 SparkFun	QWIIC SHIM FOR RASPBERRY PI	18
DEV-16824 SparkFun	KITRONIK MI:POWER BOARD	0
DEV-13684 SparkFun	MYOWARE POWER SHIELD	7
SEN-15050 SparkFun	TRIAD SPECTROSCOPY SENSORAS7265X	0
SPX-16772 SparkFun	AUTO-DIGITAL THERMOSTAT - ADT640	0
LCD-15173 SparkFun	TRANSPARENT GRAPHICAL OLED BREAK	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems