Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SEN-14347 SparkFun	QWIIC SPECTRAL SENSOR BRD AS7262	28
COM-10878 SparkFun	SPARKFUN EL ESCUDO DOS	0
SPX-17116 SparkFun	SERIAL FLASH BREAKOUT - BARE	0
COM-15168 SparkFun	QWIIC JOYSTICK BOARD	32
DEV-14430 SparkFun	ESP32 THING MOTION SHIELD	2
DEV-13995 SparkFun	TEENSY PROP SHIELD	17
DEV-13626 SparkFun	PHOTON BATTERY SHIELD 13626	5
SPX-17072 SparkFun	QWIIC MULTI DISTANCE SENSOR - VL	0
DEV-17512 SparkFun	SPARKFUN QWIIC PHAT EXTENSION FO	39
GPS-15712 SparkFun	GPS BREAKOUT NEO-M9N QWIIC U.FL	110
DEV-09729 SparkFun	PROTOSCREWSHIELD	19
DEV-10587 SparkFun	MUSIC INSTRUMENT SHIELD	3
SPX-16394 SparkFun	QWIIC IRIDIUM 9603N	0
DEV-14039 SparkFun	PIMORONI EXPLORER HAT PRO	0
SEN-17731 SparkFun	SPARKFUN QWIIC SOIL MOISTURE SEN	136
DEV-13674 SparkFun	PHOTON WEATHER SHIELD	7
DEV-14150 SparkFun	RELAYPLATE PI-PLATE	37
SEN-12589 SparkFun	SPARKFUN REDBOT SENSOR ACCEL	0
DEV-14439 SparkFun	EXPANSION DOCK FOR ONION OMEGA	0
LCD-15143 SparkFun	SPARKFUN TFT LCD BREAKOUT - 1.8	9

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems