Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
BOB-15932

BOB-15932

SparkFun

SPARKFUN QWIIC BUTTON - RED LED

162

DEV-14034

DEV-14034

SparkFun

SPECTACLE AUDIO BOARD

0

SEN-15892

SEN-15892

SparkFun

ZIO QWIIC LOUDNESS SENSOR

14

DEV-14356

DEV-14356

SparkFun

PI-TOPPROTO

0

SEN-14571

SEN-14571

SparkFun

TRIPLE AXIS MAGNETOMETER BREAKOU

39

DEV-14109

DEV-14109

SparkFun

MYOWARE CABLE SHIELD

35

DEV-17163

DEV-17163

SparkFun

ARGON40 FAN HAT FOR RASPBERRY PI

40

DEV-14155

DEV-14155

SparkFun

SPARKFUN ESP32 THING POWER CONTR

0

SPX-17353

SPX-17353

SparkFun

BMI270 BREAKOUT

0

DEV-13993

DEV-13993

SparkFun

SPECTACLE MOTION BOARD

0

GPS-13750

GPS-13750

SparkFun

SPARKFUN GPS LOGGER SHIELD

0

SPX-17718

SPX-17718

SparkFun

MICROMOD BIG DISPLAY CARRIER BOA

0

SEN-15577

SEN-15577

SparkFun

PULSED RADAR BREAKOUT - A111

13

SEN-15242

SEN-15242

SparkFun

SPARKFUN QWIIC SCALE - NAU7802

153

DEV-12085

DEV-12085

SparkFun

BEAGLEBONE BLACK CAPE - LCD (4.3

0

DEV-13262

DEV-13262

SparkFun

SHIELD CAN-BUS 13262

76

DEV-15270

DEV-15270

SparkFun

GATOR:LOG - MICRO:BIT ACCESSORY

8

DEV-17156

DEV-17156

SparkFun

SPARKFUN QWIIC SHIELD FOR TEENSY

61

SEN-14587

SEN-14587

SparkFun

SPARKFUN TRIPLE AXIS ACCELEROMET

28

SPX-17115

SPX-17115

SparkFun

SERIAL FLASH BREAKOUT - ASSEMBLE

0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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