Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SEN-15269 SparkFun	GATOR:ENVIRONMENT - MICRO:BIT AC	2
DEV-14445 SparkFun	SERVO BOARD FOR ONION OMEGA	0
GPS-15193 SparkFun	SPARKFUN GPS BREAKOUT - ZOE-M8Q	24
SEN-15344 SparkFun	CAP TOUCH SLIDER - CAP1203 (QWII	20
LCD-16774 SparkFun	ZIO QWIIC OLED DISPLAY (0.91 IN,	73
BOB-14589 SparkFun	DIFFERENTIAL I2C BREAKOUT PCA961	0
DEV-13820 SparkFun	PROTOSHIELD KIT	59
SPX-17251 SparkFun	QWIIC KEYBOARD EXPLORER - TRANSL	0
DEV-14442 SparkFun	OLED BOARD FOR ONION OMEGA	0
DEV-17724 SparkFun	SPARKFUN MICROMOD QWIIC CARRIER	0
DEV-16779 SparkFun	OPENMV FLIR LEPTON ADAPTER MODUL	56
SEN-11999 SparkFun	SPARKFUN REDBOT SENSOR - MECHANI	0
SEN-17374 SparkFun	SPARKFUN QWIIC PIR - 170UA (EKMC	50
DEV-15162 SparkFun	GATOR:BIT V2.0 CARRIER BOARD	16
DEV-16524 SparkFun	ALCHITRY BR PROTOTYPE ELEMENT BO	0
DEV-14438 SparkFun	ARDUINO DOCK R2 FOR ONION OMEGA	0
DEV-15316 SparkFun	SERVO PHAT FOR RASPBERRY PI	46
DEV-13956 SparkFun	WEATHER SHIELD	7
DEV-12660 SparkFun	SPARKFUN MP3 PLAYER SHIELD	10
DEV-13598 SparkFun	PHOTON PROTOSHIELD 13598	4

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems