Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
SPX-14688 SparkFun	PRESSURE SENSOR (QWIIC) - MS5637	0
LCD-14776 SparkFun	LCD TOUCHSCREEN RASPBERRY PI HAT	18
SPX-17120 SparkFun	SNO SHOE - ARDUINO COMPATIBLE HD	0
CEL-15087 SparkFun	LTE CAT M1/NB-IOT SHIELD - SARA-	0
SPX-15584 SparkFun	QWIIC BUTTON - RED	0
SPX-14813 SparkFun	AIR QUALITY SENSOR QWIIC SGP30	0
SPX-14764 SparkFun	QWIIC EEPROM - 512KBIT	0
DEV-14065 SparkFun	BARE CONDUCTIVE PI CAP	0
DEV-09627 SparkFun	MINI FET SHIELD	0
DEV-14153 SparkFun	THING ENVIRONMENT SENSOR SHIELD	0
DEV-07914 SparkFun	ARDUINO PROTOSHIELD	0
DEV-14213 SparkFun	SPARKFUN MOTO BIT	0
COM-13316 SparkFun	EASYVR SHIELD 3.0 - VOICE RECOGN	0
DEV-12081 SparkFun	WEATHER SHIELD	0
DEV-13039 SparkFun	BLOCK FOR INTEL EDISON - CONSOLE	0
DEV-14355 SparkFun	PI-TOPSPEAKER	0
DEV-14444 SparkFun	RELAY BOARD FOR ONION OMEGA	0
DEV-13630 SparkFun	PHOTON WEATHER SHIELD 13630	0
SEN-14843 SparkFun	ARRAY BREAKOUT 110 FOV MLX90640	0
DEV-12071 SparkFun	SPARKFUN WIFI SHIELD - CC3000	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems