Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	DEV-13183 SparkFun	CRYPTOSHIELD	0
	DEV-11018 SparkFun	RFM22 SHIELD - 434MHZ	0
	DEV-09346 SparkFun	MEGA PROTOSHIELD	0
	COM-15102 SparkFun	QWIIC QUAD RELAY	0
	DEV-12935 SparkFun	SPARKFUN FTDI SMARTBASIC	0
	SEN-14539 SparkFun	SPARKFUN DISTANCE SENSOR BREAKOU	0
	DEV-09815 SparkFun	SPARKFUN ARDUMOTO - MOTOR DRIVER	0
	DEV-13034 SparkFun	BLOCK FOR INTEL EDISON - I2C	0
	CEL-14333 SparkFun	1SHEELD+	0
	ROB-13257 SparkFun	COMMOTION MOTOR DRIVER SHIELD	0
	DEV-13035 SparkFun	BLOCK FOR INTEL EDISON - OLED	0
	DEV-10182 SparkFun	MONSTER MOTO SHIELD	0
	DEV-13041 SparkFun	BLOCK FOR INTEL EDISON - MICROSD	0
	DEV-15165 SparkFun	QWIIC MP3 TRIGGER	0
	DEV-15351 SparkFun	QWIIC PHAT FOR RASPBERRY PI	0
	DEV-11469 SparkFun	SPARKFUN TRANSMOGRISHIELD	0
	DEV-11002 SparkFun	EVAL BRD SHIELD GO-BETWEEN	0
	DEV-13327 SparkFun	BLOCK FOR INTEL EDISON - ADC	0
	KIT-13288 SparkFun	TEENSY ARDUINO SHIELD ADAP 13288	0
	DEV-13033 SparkFun	BLOCK FOR INTEL EDISON - 9 DEGRE	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems