Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	DEV-13310 SparkFun	SPARKFUN LUDUS PROTOSHIELD	0
	DEV-13687 SparkFun	MYOWARE CABLE SHIELD	0
	DEV-11649 SparkFun	DANGER SHIELD	0
	DEV-13038 SparkFun	BLOCK FOR INTEL EDISON - GPIO	0
	DEV-13037 SparkFun	BATTERY BLOCK INTEL EDISON	0
	DEV-13042 SparkFun	BLOCK FOR INTEL EDISON - PWM	0
	LCD-11740 SparkFun	ARDUINO DISPLAY MODULE - 4.3" TO	0
	DEV-12887 SparkFun	SPARKFUN ELECTRIC IMP SHIELD	0
	DEV-13040 SparkFun	BLOCK FOR INTEL EDISON - UART	0
	DEV-14328 SparkFun	SPARKFUN PI SERVO HAT	0
	SEN-15276 SparkFun	SPARKFUN LIGHTNING DETECTOR - AS	0
	DEV-15873 SparkFun	ALCHITRY BR PROTO ELEMENT BOARD	0
	SPX-15032 SparkFun	QWIIC QUAD RELAY	0
	SPX-14733 SparkFun	RGB SENSOR (QWIIC) - BH1749NUC	0
	DEV-15430 SparkFun	LEOPARD IMAGING CAMERA - 145 DEG	0
	SPX-15780 SparkFun	QWIIC IRIDIUM 9603N	0
	SPX-15413 SparkFun	HIGH PRECISION TEMPERATURE SENSO	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems