Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	CEL-13120 SparkFun	CELLULAR SHIELD MG2639	0
	DEV-13036 SparkFun	BLOCK FOR INTEL EDISON - ARDUINO	0
	DEV-13295 SparkFun	SPARKFUN LUDUS PROTOSHIELD WIREL	0
	KIT-13091 SparkFun	SPARKFUN PI WEDGE B+ 13091	0
	DEV-13045 SparkFun	BLOCK FOR INTEL EDISON 13045	0
	DEV-13043 SparkFun	BLOCK FOR INTEL EDISON - DUAL H-	0
	DEV-11665 SparkFun	ARDUINO PROTOSHIELD - BARE PCB	0
	BOB-14685 SparkFun	QWIIC MUX BREAKOUT 8 CHANNEL TCA	0
	DEV-12773 SparkFun	CRYPTOCAPE	0
	DEV-10661 SparkFun	VOICEBOX SHIELD	0
	DEV-13727 SparkFun	BLOCK FOR INTEL EDISON - POWER	0
	DEV-12086 SparkFun	BEAGLEBONE BLACK CAPE - LCD (7.0	0
	SEN-12617 SparkFun	SPARKFUN REDBOT SENSOR - WHEEL E	0
	DEV-14318 SparkFun	JUSTBOOM AMP HAT	0
	DEV-13044 SparkFun	BLOCK FOR INTEL EDISON - RASPBER	0
	DEV-10615 SparkFun	PWM SHIELD	0
	DEV-13770 SparkFun	BLOCK FOR INTEL EDISON ADC	0
	DEV-14214 SparkFun	SPARKFUN WEATHER BIT	0
	DEV-16301 SparkFun	TOP PHAT FOR RASPBERRY PI	0
	DEV-12767 SparkFun	TEENSY AUDIO BOARD	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems