Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
DEV-13116

DEV-13116

SparkFun

SPARKFUN SPECTRUM SHIELD

11

COM-14968

COM-14968

SparkFun

SPARKFUN GATOR:CONTROL PROTOSNAP

0

BOB-13709

BOB-13709

SparkFun

MYOWARE PROTO SHIELD

0

DEV-14446

DEV-14446

SparkFun

GPS BOARD FOR ONION OMEGA

0

BOB-13311

BOB-13311

SparkFun

TEENSY 3.1 XBEE ADAPTER

18

DEV-14441

DEV-14441

SparkFun

ETHERNET BOARD FOR ONION OMEGA

0

COM-15290

COM-15290

SparkFun

QWIIC KEYPAD - 12 BUTTON

33

SEN-15335

SEN-15335

SparkFun

9DOF IMU BREAKOUT - ICM-20948 (Q

421

DEV-14052

DEV-14052

SparkFun

SPECTACLE LIGHT BOARD

0

SEN-17770

SEN-17770

SparkFun

LUXONIS OAK-D DEPTHAI HARDWARE

5

DEV-13628

DEV-13628

SparkFun

PHOTON MICRO OLED SHIELD 13628

1

SEN-16466

SEN-16466

SparkFun

ENVIRONMENTAL SENSOR BREAKOUT -

112

BOB-16842

BOB-16842

SparkFun

SPARKFUN QWIIC BUTTON - GREEN LE

71

SEN-15440

SEN-15440

SparkFun

ATMOSPHERIC SENSOR BREAKOUT - BM

112

COM-14890

COM-14890

SparkFun

SPARKFUN GATOR COLOR PROTOSNAP

0

DEV-16885

DEV-16885

SparkFun

MICROMOD ATP CARRIER BOARD

29

LCD-16397

LCD-16397

SparkFun

SPARKFUN 16X2 SERLCD - RGB TEXT

34

DEV-17723

DEV-17723

SparkFun

SPARKFUN MICROMOD QWIIC CARRIER

0

WRL-14597

WRL-14597

SparkFun

SPARKFUN AST-CAN485 WIFI SHIELD

2

SEN-16476

SEN-16476

SparkFun

SPARKFUN QWIIC MICROPRESSURE SEN

132

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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