Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
101020533 Seeed	GROVE DIGITAL DISTANCE INTERRUPT	10
113060000 Seeed	GROVE 433MHZ SIMPLE RF LINK KI	4
104030004 Seeed	2.8'' TFT TOUCH SHIELD V2.0	0
103030276 Seeed	GROVE BASE FOR RASPBERRY PI ZERO	20
101020011 Seeed	GROVE TEMP/HUMIDITY SENSOR	145
102991187 Seeed	GROVE AI HAT FOR EDGE COMPUTING	6
101020051 Seeed	GROVE 3-AXIS ANALOG ACCEL	6
113990296 Seeed	LORA/GPS ARDUINO SHIELD 868MHZ	0
104030009 Seeed	GROVE WHITE LED	0
114990078 Seeed	YUN SHIELD	5
103020031 Seeed	PARTICLE PHOTON BASE SHIELD	0
103990485 Seeed	TINY GAMEPI15 DESIGNED FOR RASPB	18
101020070 Seeed	GROVE NFC TAG	5
101020634 Seeed	GROVE CO2 TEMP HUM SENSOR SCD30	122
114990838 Seeed	RASPBERRY PI WIDE ANGLE CAMERA M	228
105020012 Seeed	GROVE 6 AXIS ACCEL GYROSCOPE	114
105990110 Seeed	ROBOTBIT - ROBOT EXPANSION BOARD	0
101020812 Seeed	GROVE - HIGH PRECISION BAROMETRI	17
104020048 Seeed	GROVE CHAINABLE RGB LED V2.0	14
101990680 Seeed	GROVE - OXYGEN SENSOR (MIX8410)	45

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems