Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
101020015 Seeed	GROVE TEMPERATURE SENSOR	218
105020073 Seeed	GROVE - RGB LED MATRIX W/DRIVER	6
103100022 Seeed	BREAKOUT FOR LINKIT SMART 7688 V	0
114992262 Seeed	IMX219-130 8MP CAMERA WITH 130 F	0
101020074 Seeed	GROVE TEMP/HUMIDITY SENSOR	4
101020088 Seeed	GROVE - MULTICHANNEL GAS SENSOR	0
103030335 Seeed	KITTENBOT IOBIT SHIELD FOR MICRO	21
101020585 Seeed	GROVE - IMU 9DOF (ICM20600+AK099	49
103010002 Seeed	GROVE PI+ BOARD	37
101020492 Seeed	GROVE - 3-AIXS DIGITAL COMPASS V	62
103030278 Seeed	HIGH ACCURACY PI RTC (DS3231)	99
101020603 Seeed	GROVE - OPTOCOUPLER RELAY (M281)	123
103990143 Seeed	RASPBERRY PI VGA666 DPI DTOVERLA	0
103020008 Seeed	GROVE MOSFET	200
102991183 Seeed	MXCHIP IOTAT3080 IOTDEVELOPMENT	0
114990837 Seeed	RASPBERRY PI INFRARED CAMERA MOD	94
111020046 Seeed	GROVE BLUE LED BUTTON	22
101020712 Seeed	GROVE - ADC FOR LOAD CELL (HX711	0
107990153 Seeed	SIPEED MAIX I2S MICROPHONE	144
113030001 Seeed	NFC SHIELD V2.0	24

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems