Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
101020031 Seeed	GROVE PIEZO VIBRATION SENSOR	203
101020026 Seeed	GROVE INFRARED EMITTER	49
101020615 Seeed	GROVE 5A DC/AC CURRENT SENSOR	28
101020013 Seeed	GROVE RTC	114
103020005 Seeed	GROVE RELAY	32
101020046 Seeed	GROVE HALL SENSOR	5
104030014 Seeed	GROVE MULTI COLOR FLASH LED	0
113100002 Seeed	ROCK PI WIRELESS MODULE A1- WIRE	0
101020044 Seeed	GROVE ALCOHOL SENSOR	0
101990053 Seeed	TESSEL AMBIENT MODULE	0
104990449 Seeed	2.7'' TRIPLE-COLOR E-INK DISPLAY	1
101020556 Seeed	GROVE I2C HIGH ACCURACY TEMPERAT	90
101020132 Seeed	GROVE LIGHT SENSOR VER 1.2	273
101020042 Seeed	GROVE 80CM INFRARED PROXIMITY	0
101020341 Seeed	GROVE I2C COLOR SENSOR V2	82
109020041 Seeed	GROVE - 4 CHANNEL 16-BIT ADC (AD	53
101020193 Seeed	BOARD TPH PRESSURE TEMP BME280	0
103030000 Seeed	BASE SHIELD V2	240
103030029 Seeed	RASPBERRY PI RELAY BOARD V1.0	49
101020073 Seeed	GROVE ELECTROMAGNET	82

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems