Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
103020252 Seeed	GROVE SHIELD FOR WIO LITE - ADAF	84
101020584 Seeed	GROVE - 6-AXIS ACCELEROMETER&GYR	4
103030035 Seeed	GROVE BASE CAPE FOR BEAGLEBONE	0
101020047 Seeed	GROVE I2C TOUCH SENSOR	0
113030013 Seeed	SEEED BLE SHIELD	0
103020135 Seeed	GROVE 4CHANNEL SOLID STATE RELAY	2
103990283 Seeed	ENC28J60 OVERLAYS HAT FOR RASPBE	2
103020016 Seeed	GROVE DIFFERENTIAL AMPLIFIER	0
103030028 Seeed	RASPBERRY PI RS232 BOARD V1.0	0
101020023 Seeed	GROVE SOUND SENSOR	121
105030004 Seeed	4A MOTOR SHIELD	0
101020312 Seeed	GROVE - HEELIGHT SENSOR	0
103990445 Seeed	M.2 EXTEND BOARD FOR ROCK PI 4	30
101020028 Seeed	GROVE THUMB JOYSTICK	0
103030009 Seeed	MOD RELAY SHIELD V3.0	385
113990254 Seeed	RASPBERRY PI LORA/GPS HAT 868MHZ	0
109990286 Seeed	RASPBERRY PI SINGLE BAND RADIO H	0
107020029 Seeed	GROVE - RECORDER V3.0	0
101020002 Seeed	GROVE GAS SENSOR(O2)	5
104020131 Seeed	GROVE - RGB LED STICK (10 - WS28	117

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems