Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
107020069 Seeed	GROVE - MP3 V3 -MUSIC PLAYER	3
103030315 Seeed	ARCH MIX GROVE BREAKOUT	0
101020080 Seeed	GROVE IMU 9DOF V2.0	52
107020049 Seeed	GROVE - I2C FM RECEIVER V1.1	6
105990072 Seeed	GEAR STEPPER MOTOR DRIVER PACK	16
104020170 Seeed	GROVE - RGB LED STICK (20-WS2813	0
101020692 Seeed	GROVE - 12-BIT MAGNETIC ROTARY P	176
104990583 Seeed	5 INCH TFT DISPLAY FOR SIPEED TA	1
114990831 Seeed	RASPBERRY PI HIGH-PRECISION AD/D	318
103100142 Seeed	GROVE SHIELD FOR PI PICO V1.0	0
101020005 Seeed	GROVE COLLISION SENSOR	0
101020000 Seeed	GROVE SERIAL CAMERA KIT	6
105030006 Seeed	MOTOR BRIDGE CAPE	0
107020007 Seeed	GROVE -RECORDER V2.0	0
103020136 Seeed	GROVE 8CHANNEL SOLID STATE RELAY	3
102110497 Seeed	DUAL GIGABIT ETHERNET CARRIER BO	0
101020037 Seeed	GROVE TOUCH SENSOR	0
101020586 Seeed	GROVE - VIBRATION SENSOR (SW-420	0
103020006 Seeed	GROVE I2C HUB	234
114991702 Seeed	SIPEED MAIX BINOCULAR CAMERA	46

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems