Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
103030356 Seeed	SEEEDUINO XIAO EXPANSION BOARD	0
101020077 Seeed	GROVE DIGITAL INFRARED TEMP	5
103020013 Seeed	GROVE I2C ADC	16
103030277 Seeed	PI RTC (DS1307)	97
114990114 Seeed	CRAZYFLIE 2.0 LED-RING BOARD	0
104020172 Seeed	GROVE - RGB LED STICK (15-WS2813	0
101020174 Seeed	GROVE - INFRARED REFLECTIVE SENS	0
104030067 Seeed	2.7'' TRIPLE-COLOR E-INK SHIELD	16
101020056 Seeed	GROVE GAS SENSOR	0
101020513 Seeed	GROVE TEMPERATURE HUMIDITY PRESS	87
101990644 Seeed	GROVE AHT20 I2C INDUSTRIAL TEMP&	104
111020043 Seeed	GROVE 6POSITION DIP SWITCH	8
113020008 Seeed	GROVE - SERIAL BLUETOOTH V3.0	2
107020000 Seeed	GROVE BUZZER	216
101020212 Seeed	GROVE - TEMP & HUMIDITY SENSOR	17
101020055 Seeed	GROVE GAS SENSOR	85
101020052 Seeed	GROVE GSR	130
106100003 Seeed	DOCKERPI POWERBOARD	16
113020006 Seeed	GROVE NFC	241
101020001 Seeed	GROVE HCHO SENSOR	5

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems