Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
101020018 Seeed	GROVE WATER SENSOR	64
114992543 Seeed	4-CHANNEL SPDT RELAY HAT FOR RAS	0
106990020 Seeed	SOLAR CHARGER SHIELD V2.2	51
103100063 Seeed	GROVE SHIELD FOR MICRO:BIT V2.0	10
104020130 Seeed	GROVE RED/BLACK/WHITE 2.13" EPD	13
114991396 Seeed	FLICKZERO3D TRACK & GESTURE PHAT	0
108070022 Seeed	MDDS30 CYTRON SMARTDRIVEDUO-30	13
114992264 Seeed	IMX219-160IR 8MP CAMERA WITH 160	40
308010014 Seeed	RASPBERRY PI 3.5" TFT DISPLAY	19
114990111 Seeed	CRAZYFLIE 2.0 BREAKOUT BOARD	0
101020039 Seeed	GROVE 3AXIS DIGITAL ACCELEROM	5
113030009 Seeed	GPRS SHIELD V3.0	0
111020049 Seeed	GROVE MECH KEYCAP	2
101020872 Seeed	GROVE - 12 KEY CAPACITIVE I2C TO	19
101020632 Seeed	GROVE 3AXIS DIGITAL ACCELEROMETE	6
101020636 Seeed	GROVE - 12-CHANNEL CAPACITIVE TO	0
114991397 Seeed	FLICKHAT 3D TRACK & GESTURE HAT	0
101020091 Seeed	GROVE MINI TRACK BALL	0
114992263 Seeed	IMX219-160 8MP CAMERA WITH 160 F	31
101020048 Seeed	GROVE ROTARY ANGLE SENSOR(P)	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems