Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
105020003 Seeed	GROVE VIBRATION MOTOR	49
101020639 Seeed	GROVE 3AXIS DIGITAL ACCELEROMETE	9
101020452 Seeed	GROVE - OLED DISPLAY 1.12'' V2	0
103990057 Seeed	CAMERA SHIELD	0
103020312 Seeed	GROVE SHIELD FOR SEEEDUINO XIAO	74
111020048 Seeed	GROVE 5WAY SWITCH	26
101020600 Seeed	GROVE - I2C UV SENSOR (VEML6070)	15
111020001 Seeed	GROVE ENCODER	36
113030008 Seeed	WIFI SHIELD V2.0	0
101020192 Seeed	GROVE - BAROMETER SENSOR	145
103030215 Seeed	CANBUS SHIELD V2	801
113020009 Seeed	GROVE BLE (DUAL MODEL)	0
113020001 Seeed	GROVE 315MHZ SIMPLE RF LINK KI	3
103100062 Seeed	GROVE SHIELD FOR PARTICLE MESH	48
101020892 Seeed	GROVE - THERMAL IMAGING CAMERA -	57
106990016 Seeed	TESSEL RELAY MODULE	0
103020134 Seeed	GROVE 2CHANNEL SOLID STATE RELAY	1
103990564 Seeed	WIO TERMINAL CHASSIS - BATTERY (	0
114990814 Seeed	RF EXPLORER 3G+ IOT RASPBERRY PI	9
104030008 Seeed	GROVE OLED DISPLAY 0.96"	91

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems