Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
111020000 Seeed	GROVE BUTTON	198
114992270 Seeed	IMX219-83 8MP 3D STEREO CAMERA M	0
101990054 Seeed	TESSEL CLIMATE MODULE	0
101020036 Seeed	GROVE SLIDE POTENTIOMETER	10
111020103 Seeed	GROVE - DUAL BUTTON	10
106030000 Seeed	ENERGY SHIELD	1
101020025 Seeed	GROVE TILT SWITCH	0
113060006 Seeed	GROVE - LORA RADIO 868MHZ	5
103100001 Seeed	UARTSBEE V5	0
101020616 Seeed	GROVE 10A DC CURRENT SENSOR	30
101020062 Seeed	GROVE INFRARED TEMP SENSOR	12
101020752 Seeed	GROVE - TURBIDITY SENSOR (METER)	39
113990044 Seeed	TESSEL RFID MODULE	0
101020058 Seeed	GROVE EMG DETECTOR	27
104030011 Seeed	GROVE OLED DISPLAY 1.12"	5
101020172 Seeed	GROVE - LINE FINDER V1.1	21
101020035 Seeed	GROVE PROTOSHIELD	29
104030003 Seeed	GROVE 4-DIGIT DISPLAY	83
104030001 Seeed	GROVE LCD RGB BACKLIGHT	158
103020019 Seeed	GROVE BASE BOOSTERPACK	2

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems