Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
103020133 Seeed	GROVE 4CHANNEL SPDT RELAY	19
101020353 Seeed	GROVE MINI PIR MOTION SENSOR	262
101020050 Seeed	GROVE 3AXIS DIGITAL GYRO	11
101020557 Seeed	GROVE INFRARED SENSOR ARRAY	0
104020129 Seeed	GROVE RED/BLACK/WHITE 1.54" EPD	7
103020004 Seeed	GROVE SOLID STATE RELAY	0
101020512 Seeed	GROVE - VOC AND ECO2 GAS SENSOR	212
114990121 Seeed	CRAZYFLIE 2.0 BATTERY HOLDER BRD	0
101020012 Seeed	GROVE DUST SENSOR	56
102030005 Seeed	SPARTAN EDGE ACCELERATOR BOARD	66
114990115 Seeed	CRAZYFLIE 2.0 PROTOTYPING BOARD	0
103020002 Seeed	GROVE BEE SOCKET	6
108070021 Seeed	MD13S CYTRON 13AMP DC MOTOR DRIV	78
103020012 Seeed	GROVE SPDT RELAY 30A	19
113990660 Seeed	CORAL CAMERA MODULE	0
104030013 Seeed	GROVE CIRCULAR LED	0
113020003 Seeed	GROVE GPS	0
114992261 Seeed	IMX219-77IR 8MP IR NIGHT VISION	14
101020592 Seeed	GROVE - I2C HIGH ACCURACY TEMP&H	225
113020002 Seeed	GROVE 125KHZ RFID READER	56

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems