Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
113020000 Seeed	GROVE SERIAL RF PRO	0
104990422 Seeed	2.13" EINK DISPLAY HAT RASPBERRY	35
114990813 Seeed	RF EXPLORER 3G+ IOT ARDUINO	4
103030034 Seeed	BEAGLEBONE GREEN HDMI CAPE	47
103030021 Seeed	ETHERNET SHIELD W5500	179
114992115 Seeed	DUAL SATA HAT FOR RASPBERRY PI 4	0
107020003 Seeed	MUSIC SHIELD V2.0	0
101020582 Seeed	GROVE - 3-AXIS DIGITAL ACCELEROM	87
114992565 Seeed	GPIO SCREW TERMINAL HAT FOR RASP	0
109990291 Seeed	BLUESTACK MICRO+ (IOS VERSION)	0
111020002 Seeed	GROVE HIGH TEMP SENSOR	7
103030030 Seeed	RASPBERRY PI BREAKOUT BOARD V1.0	0
105020010 Seeed	GROVE I2C MINI MOTOR DRIVER	0
107020109 Seeed	GROVE - PASSIVE BUZZER	36
101020017 Seeed	GROVE ROTARY ANGLE SENSOR	6
104020128 Seeed	GROVE - RGB LED RING (20 - WS281	0
109990290 Seeed	BLUESTACK MICRO+ (ANDROID)	0
103060000 Seeed	PROTOSHIELD KIT FOR ARDUINO	0
114990615 Seeed	DRAGINO LORA SHIELD - 868MHZ	0
101020019 Seeed	GROVE TEMP/HUMIDITY SENSOR	150

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems