Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
103030216 Seeed	RESPEAKER 4MIC ARRAY RASPBERRYPI	26
113030016 Seeed	RS232 SHIELD	0
104990423 Seeed	2.7" EINK DISPLAY HAT RASPBERRY	1
104020005 Seeed	GROVE LED STRING LIGHT	0
101020232 Seeed	GROVE - SPEECH RECOGNIZER	4
101020071 Seeed	GROVE 3AXIS DIGITAL ACCELEROM	2
114991377 Seeed	SERIAL CANBUS MODULE	267
101020010 Seeed	GROVE ULTRASONIC RANGER	154
101020030 Seeed	GROVE DIGITAL LIGHT SENSOR	104
113020004 Seeed	GROVE XBEE CARRIER	6
111020044 Seeed	GROVE RED LED BUTTON	104
103030031 Seeed	RASPBERRY PI MOTOR BOARD V1.0	1
103020007 Seeed	GROVE SCREW TERMINAL	27
114992117 Seeed	POWER-OVER-ETHERNET (POE) HAT FO	91
104020171 Seeed	GROVE - RGB LED RING (16-WS2813	0
103100083 Seeed	3D GESTURE & TRACKING SHIELD FOR	28
103020010 Seeed	GROVE 2COIL LATCHING RELAY	25
113020091 Seeed	GROVE - LORA-E5 (STM32WLE5JC), E	0
101020038 Seeed	GROVE MAGNETIC SWITCH	3
101020078 Seeed	GROVE - AIR QUALITY SENSOR V1.3	114

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems