Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
113100003 Seeed	ROCK PI WIRELESS MODULE A2- WIRE	0
104030005 Seeed	GROVE RED LED	0
103020000 Seeed	GROVE DMX512	0
101020082 Seeed	GROVE FINGER-CLIP HEART SENSOR	8
103020024 Seeed	GROVE - FINGER-CLIP HEART RATE S	0
101020083 Seeed	GROVE - GESTURE	0
101020173 Seeed	GROVE - LIGHT SENSOR (P) V1.1	0
103030006 Seeed	SCREW SHIELD	275
104030010 Seeed	GROVE BLUE LED	0
109020021 Seeed	GROVE - DOPPLER RADAR (BGT24LTR1	9
101020004 Seeed	GROVE SWITCH	0
101020069 Seeed	GROVE TOUCH SENSOR	0
111020045 Seeed	GROVE YELLOW LED BUTTON	48
103990205 Seeed	PARTICLE POWER SHIELD WITH HEADE	0
113020011 Seeed	GROVE UART WIFI V2 ESP8285	0
102990046 Seeed	ALAMODE - ARDUINO COMPATIBLE RAS	2
101020045 Seeed	GROVE GAS SENSOR	3
105020002 Seeed	GROVE LED STRIP DRIVER	0
101020016 Seeed	GROVE INFRARED RECEIVER	18
107100001 Seeed	RESPEAKER 2-MICS PI HAT	328

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems