Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	103030004 Seeed	XBEE SHIELD V2.0	0
	101020009 Seeed	GROVE LINE FINDER	0
	103040006 Seeed	XADOW ADAPTER	0
	101990010 Seeed	7" LCD CAPE FOR BEAGLE BONE BLAC	0
	107990034 Seeed	JUSTBOOM DAC HAT FOR THE RASPBER	0
	103990058 Seeed	RASPBERRY PI B+ GPIO REF B	0
	317080021 Seeed	RASPBERRY PI 0.91'OLED DISPLAY M	0
	103990059 Seeed	RASPBERRY PI GPIO TO SERIAL PORT	0
	101990005 Seeed	MINI RTC MODULE	0
	102990178 Seeed	ARDUINO SHIELD 3D TOUCHLESS	0
	103990000 Seeed	PROTOTYPING BOARD FOR CUBIEBOARD	0
	103990055 Seeed	BLUETOOTH 4.0 LOW ENERGY SHIELD	0
	104110001 Seeed	RASPBERRY PI 3.2" DISPLAY	0
	101020029 Seeed	GROVE INFRARED REFLECTIVE SENS	0
	317990017 Seeed	RASPBERRY PI RGB-LED-MATRIX	0
	114990080 Seeed	BREAKOUT KIT FOR RASPBERRY PI	0
	103100002 Seeed	BREAKOUT FOR LINKIT SMART 7688	0
	103020015 Seeed	GROVE CAPE FOR BEAGLEBONE	0
	101020072 Seeed	GROVE BAROMETER SENSOR	0
	103990032 Seeed	SHIELD SHIELD FOR SPARK CORE	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems