Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	113040009 Seeed	XADOW GPS V2	0
	114990832 Seeed	RASPBERRY PI PIONEER600	0
	103030075 Seeed	RESPEAKER GROVE EXTENSION BOARD	0
	101040006 Seeed	XADOW BASIC SENSORS	0
	308010015 Seeed	RASPBERRY PI 4" TFT DISPLAY	0
	100040000 Seeed	XADOW IMU 9DOF	0
	112990003 Seeed	TESSEL MICROSD MODULE	0
	114990168 Seeed	RASPBERRY PI GPIO EXPND MOD	0
	103990018 Seeed	GROVE PAPILIO ANALOG	0
	114990169 Seeed	RASPBERRY PI GPIO EXPND MOD	0
	106990026 Seeed	ENERGY MONITOR SHIELD V2	0
	113040002 Seeed	XADOW BLE	0
	103990016 Seeed	PAPILIO ARCADE	0
	104010000 Seeed	XADOW OLED 0.96''	0
	101020034 Seeed	GROVE 3-AXIS DIGITAL COMPASS	0
	103990021 Seeed	DANGER SHIELD COMPLETE KITS	0
	103040003 Seeed	XADOW UV SENSOR	0
	102010002 Seeed	SEEEDUINO MOTION FRAME	0
	103020022 Seeed	GROVE MEGA SHIELD V1.1	0
	102991146 Seeed	KHADAS TONE BOARD HI-RES AUDIO B	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems