Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	104990158 Seeed	MYPIFI LED BOARD	0
	102990208 Seeed	PHOENARD PHOENEX BREADBOARD	0
	101990011 Seeed	3.5" HDD ADDON PACKAGE	0
	103030195 Seeed	GROVE SHIELD FOR MICRO:BIT	0
	114990170 Seeed	RASPBERRY PI PROTOTYPING BOARD	0
	114990587 Seeed	MONK MAKE SERVO SIX BOARD	0
	107990010 Seeed	TESSEL AUDIO MODULE	0
	101020032 Seeed	GROVE BAROMETER SENSOR	0
	101020022 Seeed	GROVE LIGHT SENSOR	0
	113040010 Seeed	XADOW NFC V2	0
	114020142 Seeed	GROVE THERMAL CAMERA 110 DEGREE	0
	107020006 Seeed	GROVE I2C FM RECEIVER	0
	101040003 Seeed	XADOW BAROMETER BMP180 V1.0	0
	103020009 Seeed	GROVE NUNCHUCK	0
	105020004 Seeed	GROVE MINI FAN	0
	104030016 Seeed	STARTER SHIELD EN (TICK TOCK)	0
	113990048 Seeed	TESSEL CAMERA MODULE	0
	104030019 Seeed	SMALL E-PAPER SHIELD V2	0
	110990439 Seeed	BREAKOUT KIT FOR RASPBERRY PI	0
	113040004 Seeed	XADOW NFC TAG	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems