Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	101020014 Seeed	GROVE LIGHT SENSOR	0
	114990223 Seeed	PI-DAC+ FULL-HD AUDIO CARD	0
	113040003 Seeed	XADOW - BLE SLAVE	0
	105020013 Seeed	GROVE - LED MATRIX DRIVER V1.0	0
	114990006 Seeed	THE SMDPROTOPAD - 43OH SMD PROTO	0
	101040004 Seeed	XADOW - IMU 10DOF	0
	103020018 Seeed	GROVE RECORDER	0
	102990205 Seeed	PHOENARD PHOENON PROTO	0
	114090004 Seeed	ME LED MATRIX 8X16 5VDC	0
	107990033 Seeed	JUSTBOOM AMP HAT FOR THE RASPBER	0
	105990030 Seeed	RGBW STRIP WIRELESS SHIELD V1.0	0
	114990229 Seeed	PHOBOT	0
	113990055 Seeed	SRF SHIELD WIRELESS TRANSCEIVER	0
	103110001 Seeed	DVK570 SHIELD FOR CUBIETRUCK	0
	109990038 Seeed	1SHEELD FOR SMARTPHONE	0
	102990206 Seeed	PHOENARD PHOENEX SHIELD	0
	101020085 Seeed	XADOW - MULTICHANNEL GAS SENSOR	0
	103990020 Seeed	GROVE PAPILIO DIGITAL	0
	105990009 Seeed	RASPBERRY PI CAMERA MODULE	0
	103990033 Seeed	RASPBERRY PI SHIELD	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems