Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	103020014 Seeed	GROVE DRY-REED RELAY	0
	113030021 Seeed	CAN-BUS SHIELD	0
	114020141 Seeed	GROVE THERMAL CAMERA 55 DEGREE	0
	114990833 Seeed	RASPBERRY PI TOUCH KEYPAD	0
	103990204 Seeed	PARTICLE RELAY SHIELD	0
	103040002 Seeed	XADOW RTC	0
	102990207 Seeed	PHOENARD PHOENEX PROTO	0
	109990289 Seeed	RASPBERRY PI DUAL BAND RADIO HOT	0
	104990163 Seeed	RASPBERRY PI 3.2" TFT DISPLAY	0
	114990116 Seeed	CRAZYFLIE 2.0 INDUCTIVE CHARGER	0
	103020001 Seeed	GROVE BASE SHIELD FOR IOIO-OTG	0
	113990077 Seeed	HYDRANFC SHIELD AND HYDRANFC ANT	0
	101040002 Seeed	XADOW-3-AXIS DIGITAL ACCELEROMET	0
	102990344 Seeed	96BOARDS SENSORS	0
	104030021 Seeed	SHIELD MATRIX	0
	103990039 Seeed	USB CONSOLE ADAPTER FOR INTEL GA	0
	101040005 Seeed	XADOW - GESTURE V1.0	0
	110990173 Seeed	RAINBOWDUINO EXTENSION BOARD	0
	104030006 Seeed	GROVE CHAINABLE RGB LED	0
	113040000 Seeed	XADOW NFC	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems