Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	101020079 Seeed	GROVE IMU 10DOF	0
	101020041 Seeed	GROVE I2C COLOR SENSOR	0
	107020002 Seeed	GROVE SERIAL MP3 PLAYER	0
	104020001 Seeed	GROVE VARIABLE COLOR LED	0
	114990109 Seeed	RASPBERRY PI B+ 40-26PIN GPIO	0
	102991007 Seeed	REPLICAPE 3D PRINTER CONTROLLER	0
	105990006 Seeed	THE LOCATOR - 43OH MTK3339 GPS L	0
	303030019 Seeed	BLUETOOTH FRAME	0
	101020021 Seeed	GROVE AIR QUALITY SENSOR	0
	104990263 Seeed	7 INCH BEAGLEBONE GREEN LCD CAPE	0
	103040004 Seeed	XADOW IMU 6DOF	0
	106030001 Seeed	ENERGY MONITOR SHIELD	0
	101040001 Seeed	XADOW-Q TOUCH SENSOR	0
	101020040 Seeed	GROVE IR DISTANCE INTERRUPTER	0
	113990088 Seeed	WIRELESS GATE SHIELD	0
	104030000 Seeed	EL SHIELD	0
	108040000 Seeed	XADOW MOTOR DRIVER	0
	104990016 Seeed	4.3'' LCD CAPE BEAGLEBONE BLK	0
	114990303 Seeed	RASPBERRY PI B+/2B HIFI DAC	0
	114990004 Seeed	WIREFREE - 43OH WIZFI210 WIFI LA	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems