Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	108020102 Seeed	GROVE - 16-CHANNEL PWM DRIVER (P	0
	110060007 Seeed	RAINBOW CUBE KIT	0
	113990496 Seeed	LTE PI HAT CAT.1 LARAR211 EUROPE	0
	104020111 Seeed	GROVE - 16 X 2 LCD (WHITE ON BLU	0
	105990071 Seeed	UNIVERSAL E-PAPER / E INK RAW PA	0
	113990071 Seeed	TESSEL BLE MODULE	0
	104040002 Seeed	XADOW 1.54''TOUCHSCREEN	0
	104040001 Seeed	XADOW - RGB OLED 96X64	0
	114990911 Seeed	EXPANSION BOARD	0
	107990007 Seeed	WOLFSON AUDIO CARD	0
	113020010 Seeed	GROVE UART WIFI	0
	113040001 Seeed	XADOW GPS	0
	103990080 Seeed	EASYVR SHIELD 3 FOR ARDUINO	0
	104990079 Seeed	LCD SHIELD KIT BLACK ON GREEN	0
	104110002 Seeed	RASPBERRY PI 3.5" DISPLAY	0
	102990011 Seeed	LOGICSTART MEGAWING	0
	114990245 Seeed	BOARD TPH PRESSURE TEMP REV.4	0
	113040007 Seeed	XADOW BLE (DUAL MODEL)	0
	103030001 Seeed	BEES SHIELD	0
	103990029 Seeed	RASPBERRY PI PROTOTYPE BOARD	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems