Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
114100001 Seeed	RASPBERRY PI RTC EXPANSION MODUL	219
105020011 Seeed	GROVE-HAPTICMOTOR	0
101020583 Seeed	GROVE - STEP COUNTER (BMA456)	0
104030007 Seeed	GROVE GREEN LED	18
103990079 Seeed	ARDUINO ADAPTER FOR RASPBERRY PI	0
103020193 Seeed	GROVE - RS485	41
101020068 Seeed	GROVE BAROMETER	5
103020192 Seeed	GROVE - RS232	0
103030296 Seeed	2-CHANNEL CAN-BUS(FD) SHIELD FOR	0
104990448 Seeed	2.13'' TRIPLE-COLOR E-INK DISPLA	0
113020031 Seeed	GROVE W600	0
104020113 Seeed	GROVE - 16 X 2 LCD (BLACK ON YEL	0
113060007 Seeed	GROVE - LORA RADIO 433MHZ	0
114990656 Seeed	CRAZYFLIE LOCO POSITIONING NODE	0
105990091 Seeed	DRIVER BREAKOUT FOR MICRO:BIT, D	0
114990655 Seeed	CRAZYFLIE LOCO POSITIONING DECK	0
101020638 Seeed	GROVE 3AXIS ANALOG ACCELEROMETER	0
101020637 Seeed	GROVE 3AXIS ANALOG ACCELEROMETER	0
103100082 Seeed	WIO EXTENSION RTC	0
308020004 Seeed	0.5" OLED DISPLAY ARDUINO SHIELD	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems