Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	108990016 Seeed	TESSEL SERVO MODULE	0
	104020112 Seeed	GROVE - 16 X 2 LCD (BLACK ON RED	0
	102020143 Seeed	GROVE - MICRO SWITCH	0
	101020578 Seeed	GROVE DIGITAL DISTANCE INTERRUPT	0
	101100002 Seeed	DOCKERPI SENSOR HUB DEVELOPMENT	0
	101020552 Seeed	GROVE CAPACITIVE TOUCH SLIDE SEN	0
	101020853 Seeed	GROVE - SPEAKER PLUS	0
	113990715 Seeed	DOCKERPI IOT NODE(A)	0
	101020553 Seeed	GROVE ROUND FORCE SENSORFSR402	0
	103990425 Seeed	ROBO PI HAT MM1	0
	101020534 Seeed	GROVE 12 KEY CAPACITIVE I2C TOUC	0
	103990403 Seeed	MT3620 ETHERNET SHIELD V1.0	0
	101020587 Seeed	GROVE - OPTICAL ROTARY ENCODER(T	0
	114991549 Seeed	CRAZYFLIE FLOW V2 DECK TOF	0
	114991550 Seeed	CRAZYFLIE Z-RANGER V2 DECK TOF	0
	103990343 Seeed	MT3620 GROVE SHIELD	0
	109030002 Seeed	DRAGINO NB-IOT SHIELD-B5	0
	101020554 Seeed	GROVE HUMAN PRESENCE SENSOR AK97	0
	108020103 Seeed	GROVE - I2C MOTOR DRIVER (TB6612	0
	101020532 Seeed	GROVE TIME OF FLIGHT DISTANCE SE	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems