Evaluation Boards - Expansion Boards, Daughter Cards

Image	Part Number	Description / PDF	Quantity	Rfq
	114990108 Seeed	RTC MODULE SUPER CAPACITOR	0
	103020213 Seeed	NRF52840 MDK BASE DOCK	0
	101020087 Seeed	GROVE - TEMPERATURE&HUMIDITY SEN	0
	103040000 Seeed	XADOW COMPASS	0
	107020005 Seeed	GROVE FM RECEIVER	0
	113990046 Seeed	TESSEL GPS	0
	114990005 Seeed	THE PROTOPAD - 43OH PROTOTYPING	0
	103030002 Seeed	MBED SHIELD	0
	317080006 Seeed	RASPBERRY PI 0.96" OLED DISPLAY	0
	104020002 Seeed	GROVE PURPLE LED	0
	101020053 Seeed	GROVE SINGLE AXIS ANALOG GYRO	0
	107990035 Seeed	JUSTBOOM DIGI HAT FOR THE RASPBE	0
	103990060 Seeed	RASPBERRY PI B+ AD/DA EXPANSION	0
	102040005 Seeed	XADOW GSM + BLE	0
	113990007 Seeed	THE BLUEPACK - 43OH BLUETOOTH LA	0
	105020005 Seeed	GROVE EL DRIVER	0
	103030027 Seeed	WIFI SHIELD FI250 V1.1	0
	101990066 Seeed	RASPBERRY TEMP SENSOR	0
	114990253 Seeed	ARDUINO SHIELD FOR PHOTON	0
	103040001 Seeed	XADOW BAROMETER	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems