Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
PIM414 Pimoroni	BREAKOUT GARDEN PHAT	4
PIM422 Pimoroni	ADS1015 +/-24V ADC BREAKOUT	107
PIM541 Pimoroni	AUDIO AMP SHIM (3W MONO AMP)	0
PIM511 Pimoroni	HAT HACKER HAT	18
PIM498 Pimoroni	UNICORN HAT MINI	46
PIM137 Pimoroni	EXPLORER PHAT (INIDIVIDUAL)	0
PIM028 Pimoroni	FLOTILLA TOUCH 4 CAPACITIVE	13
PIM554 Pimoroni	PICO PROTO	0
PIM545 Pimoroni	PICO SCROLL PACK	0
PIM215 Pimoroni	PICADE HAT (HAT ONLY)	1
PIM354 Pimoroni	LED SHIM	8
PIM271 Pimoroni	WIDE INPUT SHIM KIT	0
PIM432 Pimoroni	INKY WHAT BLACK/WHITE EPD	14
4TR-PISTEP2Q Pimoroni	PISTEP2 QUAD STEPPER MOTOR CONTR	0
PIM032 Pimoroni	FLOTILLA MATRIX 8X8 WHITE LED	12
PIM447 Pimoroni	TRACKBALL BREAKOUT	7
PIM095 Pimoroni	PIANO HAT (INDIVIDUAL)	6
PIM170 Pimoroni	MINI BLACK HAT HACK3R SOLDER KIT	12
PIM435 Pimoroni	5X5 RGB MATRIX BREAKOUT	21
PIM478 Pimoroni	BREAKOUT GARDEN MINI (I2C + SPI)	47

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems