Evaluation Boards - Expansion Boards, Daughter Cards

Image Part Number Description / PDF Quantity Rfq
ZERO4U_V1.3

ZERO4U_V1.3

Pimoroni

ZERO4U

26

PIM301

PIM301

Pimoroni

BUTTON SHIM

26

SHU_A_BLKFSZZZV100

SHU_A_BLKFSZZZV100

Pimoroni

SHUTTLE

40

IQA002

IQA002

Pimoroni

PI-DIGIAMP+

3

PIM544

PIM544

Pimoroni

PICO AUDIO PACK (LINE-OUT AND HE

0

PIM413

PIM413

Pimoroni

LTR-559 LIGHT & PROXIMITY SENSOR

0

PIM250

PIM250

Pimoroni

PAN-TILT HAT (WITHOUT PAN-TILT)

0

4TR-PWRBIT

4TR-PWRBIT

Pimoroni

POWER:BIT BATTERY POWER FOR MICR

28

PIM169

PIM169

Pimoroni

MINI BLACK HAT HACK3R ASSEMBLED

473

PIM475

PIM475

Pimoroni

HYPERPIXEL 4.0 SQUARE - HI-RES D

0

PIM502

PIM502

Pimoroni

ENVIRO+ FEATHERWING

19

MNK00064

MNK00064

Pimoroni

RGB LED FOR MICRO:BIT

0

PIM479

PIM479

Pimoroni

DRV8830 DC MOTOR DRIVER BREAKOUT

31

PIM462

PIM462

Pimoroni

PICADE X HAT USB-C

5

PIM455

PIM455

Pimoroni

HT0740 40V / 10A SWITCH BREAKOUT

31

STA___BLKBSRDRV100

STA___BLKBSRDRV100

Pimoroni

STATION

40

MNK00074

MNK00074

Pimoroni

POWER FOR MICRO:BIT

0

RPI-031

RPI-031

Pimoroni

RASPBERRY PI TV HAT

0

4TR-CUBE5

4TR-CUBE5

Pimoroni

5X5X5-CUBE:BIT MAGICAL RGB CUB

0

PIM476

PIM476

Pimoroni

1.3" SPI COLOUR LCD (240X240) BR

17

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Microcontroller EVBsARM/FPGA SoC integration, onboard sensors, debug interfacesIoT edge devices, smart sensors
Expansion BoardsStandard interfaces (PCIe, USB-C), protocol convertersIndustrial gateways, communication modules
Daughter CardsSpecialized functionality modules (ADC/DAC, RF transceivers)Medical imaging equipment, test instruments
Programmer KitsFlash programming, JTAG/SWD debugging, voltage monitoringAutomotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

  • Multi-layer PCB with high-speed traces
  • Processor sockets or soldered-down SoCs
  • Standardized connectors (2.54mm headers, M.2)
  • Onboard memory (RAM, Flash storage)
  • Power management ICs and voltage regulators
  • Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

ParameterDescription
Clock SpeedDetermines processing capability (1MHz-2GHz range)
Bus WidthMemory bandwidth (8/16/32-bit configurations)
Interface SupportUSB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power ConsumptionTypical range: 0.5W-25W (varies with workload)
Operating TemperatureIndustrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

  • Telecommunications (5G base stations, optical transceivers)
  • Medical equipment (MRI scanners, patient monitors)
  • Industrial automation (PLC controllers, robotics)
  • Consumer electronics (smart home devices, wearables)
  • Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

VendorProduct Series
XilinxZynq UltraScale+ MPSoC Evaluation Kit
IntelStratix 10 GX FPGA Development Board
STMicroelectronicsSTM32 Nucleo Expansion Boards
Texas InstrumentsProcessor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

  • Match SoC architecture to target application requirements
  • Verify interface compatibility with existing systems
  • Evaluate available ecosystem (IDE support, middleware)
  • Consider power budget and thermal management needs
  • Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

  • Integration of AI accelerators (NPU modules)
  • Adoption of 5nm/3nm process technologies
  • Expansion of RISC-V based evaluation platforms
  • Increased focus on functional safety (ISO 26262 compliance)
  • Growing adoption of modular "Lego-style" prototyping systems
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