Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
IQA001 Pimoroni	PI-DAC+	4
PIM213 Pimoroni	AUTOMATION HAT (INDIVIDUAL)	0
RASPIO-004 Pimoroni	RASPIO ANALOG ZERO	29
PIM542 Pimoroni	AUDIO DAC SHIM (LINE-OUT)	0
KIT-5623 Pimoroni	SERVO:LITE BOARD FOR MICRO:BIT	0
PIM054 Pimoroni	UNICORN HAT (INDIVIDUAL)	11
PIM537 Pimoroni	INKY:BIT	23
PIM525 Pimoroni	PA1010D GPS BREAKOUT	40
PIM185 Pimoroni	ZERO LIPO (INDIVIDUAL)	41
PIM457 Pimoroni	PINBETWEEN FOR MICRO:BIT	29
KIT-5609 Pimoroni	PROTOTYPING SYSTEM FOR THE BBC M	0
PIM375 Pimoroni	BH1745 LUMINANCE AND COLOUR SENS	0
PIM183 Pimoroni	PAN-TILT HAT (FULL KIT)	19
PIM486 Pimoroni	ENVIRO FOR RASPBERRY PI	4
KIT-5610 Pimoroni	MI:POWER BOARD FOR THE BBC MICRO	0
PIM442 Pimoroni	11X7 LED MATRIX BREAKOUT	8
PIM522 Pimoroni	RGB ENCODER BREAKOUT	32
MNK00061 Pimoroni	RELAY FOR MICRO:BIT	225
PPMB00111 Pimoroni	SIMON:SAYS FOR MICRO:BIT	23
PIM402 Pimoroni	MINI.MU SPEAKER	22

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems