Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
4TR-BIT2PIA Pimoroni	BIT:2:PI	5
PIM458 Pimoroni	ENVIRO+ FOR RASPBERRY PI	2
PIM368 Pimoroni	BLACK/WHITE INKY PHAT EPAPER	0
PIM272 Pimoroni	TOUCH PHAT	14
PIM369 Pimoroni	HYPERPIXEL 4.0 (TOUCH)	0
PIM401 Pimoroni	TOUCH:BIT	17
MNK00085 Pimoroni	SLIDER FOR MICRO:BIT	14
PIM487 Pimoroni	AUTOMATION HAT MINI	33
PIM184 Pimoroni	BLINKT (INDIVIDUAL)	89
PIM082 Pimoroni	EXPLORER HAT PRO (INDIVIDUAL)	2
POL-3752 Pimoroni	POLOLU DUAL G2 HIGH-POWER MOTOR	0
PIM517 Pimoroni	IO EXPANDER BREAKOUT	41
PIM411 Pimoroni	BMP280 BREAKOUT TEMPERATURE, P	13
PIM013 Pimoroni	PIGLOW	34
4TR-ANGLEBIT Pimoroni	ANGLE:BIT - TURN YOUR MICRO:BIT	17
POL-3754 Pimoroni	POLOLU DUAL G2 MOTOR DRIVE 18V22	0
PIM408 Pimoroni	INKY WHAT BLACK/RED/WHITE EPD	10
PIM141 Pimoroni	DRUM HAT (INDIVIDUAL)	25
PIM370 Pimoroni	HYPERPIXEL 4.0 (NON-TOUCH)	4
PIM376 Pimoroni	LSM303D 6DOF MOTION SENSOR BREAK	25

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems