Evaluation Boards - Expansion Boards, Daughter Cards

Part Number	Description / PDF	Quantity
PIM546 Pimoroni	PICO UNICORN PACK	0
PROTO-001 Pimoroni	PROTOZERO	0
MNK00066 Pimoroni	7-SEGMENT FOR MICRO:BIT	11
PIM400 Pimoroni	GFX HAT-128X64 LCD DISPLAY WITH	2
PIM491 Pimoroni	SCROLL HAT MINI - WHITE	13
MNK0072 Pimoroni	CO2 SENSOR FOR MICRO:BIT	14
PIM445 Pimoroni	BREAKOUT GARDEN HAT (I2C + SPI)	26
PIM034 Pimoroni	FLOTILLA JOYSTICK W/ BUTTON	11
PIM449 Pimoroni	RV3028 REAL-TIME CLOCK BREAKOUT	2
PIM524 Pimoroni	PIRATE AUDIO: DUAL MIC FOR RASPB	19
PIM536 Pimoroni	FLAT HAT HACKER	21
PIM322 Pimoroni	PHAT STACK FULLY ASSEMBLED KIT	19
PIM269 Pimoroni	ONOFF SHIM RASP PI POWER SWITCH	39
MNK00060 Pimoroni	SPEAKER FOR MICRO:BIT	0
PIM406 Pimoroni	UBERCORN 16X16 RGB LED MATRIX	14
4TR-BITCOM Pimoroni	BIT:COMMANDER CONSOLE & CONTROLL	0
PIM038 Pimoroni	FLOTILLA - DOCK	45
PIM452 Pimoroni	DRV2605L LINEAR ACTUATOR HAPTIC	25
PISUPPLY-002 Pimoroni	PAPIRUS ZERO A EPAPER / EINK S	21
PIM551 Pimoroni	PICO RGB KEYPAD BASE	0

Evaluation Boards - Expansion Boards, Daughter Cards

1. Overview

Evaluation Boards (EVBs), Expansion Boards, and Daughter Cards are essential hardware tools for embedded system development, prototyping, and testing. These platforms enable engineers to assess processor capabilities, interface peripherals, and validate designs before mass production. Their modular architecture supports rapid innovation in IoT, automotive, industrial automation, and consumer electronics sectors.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Microcontroller EVBs	ARM/FPGA SoC integration, onboard sensors, debug interfaces	IoT edge devices, smart sensors
Expansion Boards	Standard interfaces (PCIe, USB-C), protocol converters	Industrial gateways, communication modules
Daughter Cards	Specialized functionality modules (ADC/DAC, RF transceivers)	Medical imaging equipment, test instruments
Programmer Kits	Flash programming, JTAG/SWD debugging, voltage monitoring	Automotive ECUs, aerospace controllers

3. Structure and Components

Typical architecture includes:

Multi-layer PCB with high-speed traces
Processor sockets or soldered-down SoCs
Standardized connectors (2.54mm headers, M.2)
Onboard memory (RAM, Flash storage)
Power management ICs and voltage regulators
Debug interfaces (SWD, JTAG, UART)

4. Key Technical Specifications

Parameter	Description
Clock Speed	Determines processing capability (1MHz-2GHz range)
Bus Width	Memory bandwidth (8/16/32-bit configurations)
Interface Support	USB 3.0, Ethernet, CAN, SPI/I2C compatibility
Power Consumption	Typical range: 0.5W-25W (varies with workload)
Operating Temperature	Industrial (-40 C to +85 C) or commercial grade

5. Application Areas

Major industries include:

Telecommunications (5G base stations, optical transceivers)
Medical equipment (MRI scanners, patient monitors)
Industrial automation (PLC controllers, robotics)
Consumer electronics (smart home devices, wearables)
Automotive (ADAS systems, V2X communication)

6. Leading Manufacturers and Products

Vendor	Product Series
Xilinx	Zynq UltraScale+ MPSoC Evaluation Kit
Intel	Stratix 10 GX FPGA Development Board
STMicroelectronics	STM32 Nucleo Expansion Boards
Texas Instruments	Processor DKx Daughter Cards

7. Selection Guidelines

Key considerations:

Match SoC architecture to target application requirements
Verify interface compatibility with existing systems
Evaluate available ecosystem (IDE support, middleware)
Consider power budget and thermal management needs
Assess long-term availability and RoHS compliance

8. Industry Trends

Future developments include:

Integration of AI accelerators (NPU modules)
Adoption of 5nm/3nm process technologies
Expansion of RISC-V based evaluation platforms
Increased focus on functional safety (ISO 26262 compliance)
Growing adoption of modular "Lego-style" prototyping systems